Erstellung von Kalkulationen und Angeboten für Projekte in Fördertechnik, Steigtechnik und Stahlbau
Analyse und Bewertung von Kundenanfragen (Material, Geräte, Leistungen, Aufwände)
Unterstützung der Projektleiter in der Projektkalkulation und -umsetzung
Erstellung von Leistungsverzeichnissen und Ma
Erstellung von Kalkulationen und Angeboten für Projekte in Fördertechnik, Steigtechnik und Stahlbau
Analyse und Bewertung von Kundenanfragen (Material, Geräte, Leistungen, Aufwände)
Unterstützung der Projektleiter in der Projektkalkulation und -umsetzung
Erstellung von Leistungsverzeichnissen und Ma
mehr
Noch nichts dabei? Es gibt 1 weiteren Job, der zu deiner Suche passen könnte
Wir sind eine international tätige Unternehmensgruppe der Zulieferindustrie für die Baumaschinen- und Nutzfahrzeugbranche mit Werken in verschiedenen europäischen Ländern. Am Standort in Elsterheide produzieren wir mit 400 Mitarbeitern ca. 70 000 Tonnen Sphäroguss. Wir liefern sowohl rohe als auch b
Wir sind eine international tätige Unternehmensgruppe der Zulieferindustrie für die Baumaschinen- und Nutzfahrzeugbranche mit Werken in verschiedenen europäischen Ländern. Am Standort in Elsterheide produzieren wir mit 400 Mitarbeitern ca. 70 000 Tonnen Sphäroguss. Wir liefern sowohl rohe als auch b
Dresden, Frankfurt am Main, Jettingen-Scheppach, München
Teilweise Home-Office
Schnelle Bewerbung
Bei CANCOM erwartet dich ein innovatives, agiles und nachhaltiges Umfeld: Mehr als 5.300 Mitarbeiter arbeiten tagtäglich daran, mit Hilfe moderner IT-Lösungen die Zusammenarbeit und den Austausch in verschiedenen Lebensbereichen zu verbessern. Du hast Lust ein Teil davon zu sein und den nächsten Kar
Bei CANCOM erwartet dich ein innovatives, agiles und nachhaltiges Umfeld: Mehr als 5.300 Mitarbeiter arbeiten tagtäglich daran, mit Hilfe moderner IT-Lösungen die Zusammenarbeit und den Austausch in verschiedenen Lebensbereichen zu verbessern. Du hast Lust ein Teil davon zu sein und den nächsten Kar
The Center for Translational Bone, Joint, and Soft Tissue Research was founded in late 2010 as a central scientific institution of the University Hospital and the Faculty of Medicine at Dresden University of Technology to conduct interdisciplinary research on issues in musculoskeletal medicine and r
The Center for Translational Bone, Joint, and Soft Tissue Research was founded in late 2010 as a central scientific institution of the University Hospital and the Faculty of Medicine at Dresden University of Technology to conduct interdisciplinary research on issues in musculoskeletal medicine and r
This position is part of a 5-year research program funded by the German Cancer Aid (DKH), which aims to develop and clinically evaluate an AI-based assistance system for function-preserving minimally invasive rectal cancer surgery. The project involves multicenter data collection and AI development
This position is part of a 5-year research program funded by the German Cancer Aid (DKH), which aims to develop and clinically evaluate an AI-based assistance system for function-preserving minimally invasive rectal cancer surgery. The project involves multicenter data collection and AI development
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
BBC Cellpack was founded in 1935 in Vilmergen, Switzerland, as a successor to Dreifuss Brothers AG.
Originally focused on cellophane packaging, the company quickly evolved through the pioneering spirit of the Dreifuss brothers, who recognized the potential of new materials and developed high-qual
BBC Cellpack was founded in 1935 in Vilmergen, Switzerland, as a successor to Dreifuss Brothers AG.
Originally focused on cellophane packaging, the company quickly evolved through the pioneering spirit of the Dreifuss brothers, who recognized the potential of new materials and developed high-qual
Amazon Web Services (AWS) is looking for a regionally responsible Electrical Safety Officer (VEFK) for our team in Berlin-Brandenburg.We want to be the most customer-centric company in the world, and we're looking for the brightest minds to help us get there. Innovation and creativity are deeply emb
Amazon Web Services (AWS) is looking for a regionally responsible Electrical Safety Officer (VEFK) for our team in Berlin-Brandenburg.We want to be the most customer-centric company in the world, and we're looking for the brightest minds to help us get there. Innovation and creativity are deeply emb
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
Als Schadenregulierer / Schadensachverständiger im Global Technical Services (GTS) Team unterstützt Du unsere Kunden bei komplexen Schäden in Bau-, Gewerbe- und Industrieumfeldern sowie in den Technischen Versicherungen (u. a. Bauleistung und Maschinenversicherung). Du analysierst Schadenursachen, b
Als Schadenregulierer / Schadensachverständiger im Global Technical Services (GTS) Team unterstützt Du unsere Kunden bei komplexen Schäden in Bau-, Gewerbe- und Industrieumfeldern sowie in den Technischen Versicherungen (u. a. Bauleistung und Maschinenversicherung). Du analysierst Schadenursachen, b
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
ADP Global Payroll is leading Payroll and Time market in the World and provides services to multi-national clients looking for outsourcing solutions. Global Payroll Organization is committed to providing world-class service to all clients by hiring, developing, and retaining qualified service profes
ADP Global Payroll is leading Payroll and Time market in the World and provides services to multi-national clients looking for outsourcing solutions. Global Payroll Organization is committed to providing world-class service to all clients by hiring, developing, and retaining qualified service profes
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
Who we areWeltec Engineering is a well-established provider of Mechanical and Electrical engineering services, delivering complex, high-quality solutions across Europe. We support major clients in the Semiconductor, Pharma/Biopharma, and Advanced Manufacturing sectors and are committed to the highes
Who we areWeltec Engineering is a well-established provider of Mechanical and Electrical engineering services, delivering complex, high-quality solutions across Europe. We support major clients in the Semiconductor, Pharma/Biopharma, and Advanced Manufacturing sectors and are committed to the highes
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
The position is embedded in an interdisciplinary and international research environment within the “Surgical Artificial Intelligence” research group led by Dr. Fiona Kolbinger, which is jointly affiliated with the Department of Visceral, Thoracic and Vascular Surgery and the Else Kröner Fresenius Ce
The position is embedded in an interdisciplinary and international research environment within the “Surgical Artificial Intelligence” research group led by Dr. Fiona Kolbinger, which is jointly affiliated with the Department of Visceral, Thoracic and Vascular Surgery and the Else Kröner Fresenius Ce
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
Unser Mandant ist ein international tätiges Unternehmen und verbindet die Stabilität eines etablierten mittelständischen Unternehmens mit der Dynamik eines neuen Kapitels. Als spezialisierter Entwicklungspartner für individuelle Werkzeug- und Systemlösungen unterstützt das Unternehmen seit vielen Ja
Unser Mandant ist ein international tätiges Unternehmen und verbindet die Stabilität eines etablierten mittelständischen Unternehmens mit der Dynamik eines neuen Kapitels. Als spezialisierter Entwicklungspartner für individuelle Werkzeug- und Systemlösungen unterstützt das Unternehmen seit vielen Ja
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
European Semiconductor Manufacturing Company (ESMC) GmbH is the joint venture between TSMC, Bosch, Infineon and NXP. For the first time, global technology leader TSMC is building a semiconductor fab in the heart of Europe, offering cutting-edge manufacturing technologies for next-generation sem
Was ist das Durchschnittsgehalt für Technical Assistant in Bernsdorf?
Durchschnittsgehalt pro Jahr
37.600 €
Das Durchschnittsgehalt für Technical Assistant in Bernsdorf liegt bei 37.600 €. Gehälter für Technical Assistant in Bernsdorf liegen im Bereich zwischen 31.400 € und 46.700 €.
Häufig gestellte Fragen
Wie viele offene Stellenangebote gibt es für Technical Assistant Jobs in Bernsdorf?
Aktuell gibt es auf StepStone 2 offene Stellenanzeigen für Technical Assistant Jobs in Bernsdorf.
Welche anderen Orte sind auch beliebt für Leute, die in Bernsdorf einen Technical Assistant Job suchen?
Folgende Orte sind auch interessant für Leute, die in Bernsdorf einen Technical Assistant Job suchen: Dresden, Cottbus, Radeberg.
Welche anderen Jobs sind beliebt bei Kandidaten, die nach Technical Assistant Jobs in Bernsdorf suchen?