As Senior Principal Engineer – GaN Package Development (m/f/d), you will be a technical authority and innovation leader responsible for defining, developing, and industrializing advanced packaging technologies for GaN power devices and modules. This role drives package architecture strategy, leads complex cross‑functional programs from concept to high‑volume manufacturing, and serves as a key technical interface across R&D, manufacturing, suppliers, and customers. * Define supplier, materials, and equipment strategies and lead key external partnerships
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