Act as technical lead across cross-functional teams, influencing device design, product definition, and system trade-offs - This role drives package architecture strategy, leads complex cross‑functional programs from concept to high‑volume manufacturing, and serves as a key technical interface across R&D, manufacturing, suppliers, and customers. We are seeking talented individuals with deep technical expertise, an open mindset, and a drive to solve complex challenges and turn ideas into practical, scalable solutions. As Senior Principal Engineer – GaN Package Development (m/f/d), you will be a technical authority and innovation leader responsible for defining, developing, and industrializing advanced packaging technologies for GaN power devices and modules. * Lead GaN package architecture development, from concept through validation, optimizing electrical, thermal, and reliability performance
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